Shenzhen HTWY Technology Co., Ltd
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描述
聯絡供應商
描述
- HCC PCB craft ability introduction.
- Surface finish: HASL, immersion gold, gold plating, OSP, immersion tin, etc.
- Layers: 2-30.
- Minimum line width: 3mil.
- Minimum line space: 3mil.
- Min. space between pad to pad: 3mil.
- Minimum hole diameter: 0.10mm.
- Min. bonding pad diameter: 10mil.
- Max. proportion of drilling hole and board thickness: 1:12.5.
- Max. size of finish board: 23 inch x 35 inch.
- Rang of finish board’s thickness: 0.21-7.0mm.
- Minimum thickness of soldermask: 10um.
- Soldermask: green, yellow, black, blue, white, red, soldermask.
- Minimum line width of idents: 4mil.
- Min height of idents: 25mil.
- Color of silk-screen: white, yellow, black, green.
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