This is a machine for pick & place and bonding technology. This pick & place machine is clip mounted and the minimum size is 0201. It is IC mounted and the fine pitch is in 0.3mm of QFP. The BGA or micro BGA has a diameter of 0.4mm with a 0.8mm pitch. Diameter of the ball is 0.3mm and it comes with a 0.5mm pitch CSP.

• Bonding Technology: aluminium wire bonding
• Flip chip bonding: ACF, C4 and C5 Technology
• Convenient to operate