FLEX PLUS (XIAMEN) CO., LTD
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Split Flex FPCB
品牌名稱:
non-brand
顏色:
Yellow
尺寸:
7cm x 4cm
付款方式:
T/T
是否有包裝:
有
是否可訂造:
是
板厚:
248um, 0.248mm
最小線距:
0.075mm
最小線寬:
0.075mm
基板材質:
polyamide
銅厚:
1/3oz; 1/2oz; 1oz; 2oz
最小孔徑:
0.2mm
表面處理:
Immersion Gold; Plated Gold
鍍通孔種類:
鍍通孔印製電路板
描述
聯絡供應商
描述
● Single-sided with 2 to 8 layers
● CEM-3, ceramic substrate, high-Tg, Rogers, and aluminum based board
● Dimension tolerance : ±0.15mm
● Board thickness coverage : 0.3 to 4.0 mm
● Board thickness tolerance : ±15%
● Minimum line width : 0.20 mm
● Minimum line space : 0.20 mm
● Outer layer copper thickness : 12 to 70µm
● Inner layer copper thickness : 12 to 70µm
● Drilling hole diameter : 0.3 to 6.00 mm
● Finished hole diameter : 0.25 to 6.00 mm
● Laser drill hole size : 0.15 mm
● Board thickness and hole diameter ratio : 12 : 1
● Insulation resistance : 10 Kohm - 20 Mohm
● Certification : SO 14001:2004, TS 16949, ROHS COMPLIANT, UL Registered
● OEM accepted
● CEM-3, ceramic substrate, high-Tg, Rogers, and aluminum based board
● Dimension tolerance : ±0.15mm
● Board thickness coverage : 0.3 to 4.0 mm
● Board thickness tolerance : ±15%
● Minimum line width : 0.20 mm
● Minimum line space : 0.20 mm
● Outer layer copper thickness : 12 to 70µm
● Inner layer copper thickness : 12 to 70µm
● Drilling hole diameter : 0.3 to 6.00 mm
● Finished hole diameter : 0.25 to 6.00 mm
● Laser drill hole size : 0.15 mm
● Board thickness and hole diameter ratio : 12 : 1
● Insulation resistance : 10 Kohm - 20 Mohm
● Certification : SO 14001:2004, TS 16949, ROHS COMPLIANT, UL Registered
● OEM accepted
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