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Stereo Rom Module
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生產所需時間:
7 日
產品型號:
BTM-640
品牌名稱:
Rayson
尺寸:
13.4 x 13.4mm
港口:
Hong Kong
付款方式:
TBD
最低訂購數量:
1,000 piece(s)
描述
聯絡供應商
描述

This is a Bluetooth class 2 (max. 4dBm) module. It is based on the CSR 8640 ROM version chip set which supports Bluetooth V3.0 standard. The embedded kalimba DSP co-processor supports advanced features such as echo cancellation, noise reduction, and stereo audio (A2DP profile) communications. Advanced user interface design allows multi-point HFP or A2DP connections and secures simple pairing. The integrated stereo DAC provide high quality audio performance with SNR up to 95dB. It can support digital audio bus such as PCM, I2S or SPDIF and the on chip switched-mode regulator and Li-ion battery charger eliminate the needs of external components and costs. It is the true single chip solution to audio applications. Internal ROM, serial flash and EEPROM enable the flexibilities of the module to meet various kinds of applications.

Product specification:

  • BC08 stereo ROM module (CSR 8640) with APTX.
  • Max.4dBm (Class2) module.
  • Bluetooth standard: Bluetooth 3.0.
  • RF power: 4dBm maximum.
  • Receiving sensitivity: -85dBm.
  • Program memory: ROM version.
  • Physical interfaces: digital PIOs, analogue IOs.
  • Supply voltage: 2.7V – 4.25V.
  • Integrated switched-mode regulator.
  • Integrated battery charger.
  • Embedded Kalimba DSP co-processor.
  • Integrated 16-bit stereo audio codec 93dB SNR for DAC.
  • CSR’s latest CVC technology for narrowband and wideband voice connections including wind noise reduction.
  • Wideband speech supported by HFP v1.6.
  • Profile and mSBC codec.
  • Multipoint HFP connection to 2 phones for voice.
  • Multipoint A2DP connection enables a headset (A2DP) connection to 2 A2DP source device for music playback.
  • SBC, MP3, AAC, Fast stream support.
  • HSP v1.2/ HFP v1.6/ A2DP v1.2/ AVRCP v1.4.
  • Voice prompts (SPI flash).
  • RoHS compliant.
  • Dimension 13.4 x 13.4 x 2.7mm (8M SPI Flash for voice prompts); 13.4 x 13.4 x 1.9mm (EEPROM).


Applications:

  • High quality wireless stereo headset.
  • High quality wireless stereo speaker.
  • Hands-free car kits.
  • VoIP or land line phones wireless headsets.


Product benefits:

  • Cost effective ROM version.
  • Simple design and easy to use.
  • Flexible configurations for various kinds of applications.

雷鬆科技股份有限公司

雷鬆科技股份有限公司

台灣新竹市

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