Thermal conductive soft pads are specially designed for the purpose of high performance thermally conductivity to solve some of most difficult thermal problems.
The material is made to conform to the irregular surface under moderate application pressures.
The products are widely applied to electronic parts such as IC, CPU, LED, laptops, PC, DVD application and so on. It has also been used in memory modules, heat pipe assemblies, voltage regulators and automotive electronics.
Fiber glass carrier can be added for improved mechanical strength and also provides an adhesive for improved application performance.
Ranges from normal to high thermal conductivity.
High self-adhesion performance on surface to reduce contact resistance.
High temperature endurance with UL recognized flammability rating.
Available with and without PSA.
Customized die-cut service available upon customers' request.