Engineered for the semiconductor industry's wafer dicing processes, AlphaPro 8510 is a high - performance UV - releasable dicing tape. It has a composite structure made up of an 80μm PO base material and a 10μm UV adhesive layer, with an overall thickness of 90μm. This tape combines high initial adhesion with UV - triggered release capabilities. Before UV exposure, it offers a peel strength of 550gf/25mm, which firmly secures the wafers. After being irradiated with 300 - 800mj/cm² of UV light from 365nm LED or high - pressure mercury lamps, the peel strength drops sharply to 6gf/25mm. This allows for the chip to be removed without damage, significantly improving the collection efficiency.

Technical Specifications:

• Tensile Strength: 25N/15mm (TD) and 35N/15mm (MD)
• Elongation at Break: 450% (TD) and 300% (MD)
• Release Film Thickness: 38μm, providing a good balance of flexibility and tear - resistance