This ultrasonic soldering machine is designed for soldering of sputtering target in order to join the backing plate. The machine works on the indium or tin coating for a variety of materials such as molybdenum, aluminum, ITO glass and copper. This ultrasonic soldering machine features a long life span and is easy to operate.

• Cost-efficient.
• Available in other designs.

Video Files on Youtube
Ultrasonic Sputtering Target Bonding Machine
http://youtu.be/LQaijuPQu2E

Ultrasonic Cylindrical Sputtering Target Bonding Machine
http://youtu.be/g5Z94GiflQ8

Ultrasonic Bonding Machine for Sputtering Target
http://youtu.be/I_4BiBGG8dE

Aluminum Case Soldering by Ultrasonic Soldering Iron
http://youtu.be/ck137HJk_6U

Other ultrasonic applications of MECSTECH
http://www.youtube.com/user/mecstech